![\"electronics](\"https:\/\/frontend-assets.simscale.com\/media\/2022\/03\/electronics-enclosure-snap-fit-cover.gif\")
<\/a>Cloud-Native Simulation Workflow<\/h2>\n\n\n\n
The simulation workflow in SimScale, which can be repeated and applied to many different use-cases, starts by uploading a solid body CAD geometry to the platform. By using automatic body meshing, the model is quickly ready for simulation. Though the geometry of this case study was relatively uncomplicated, the physics used within the structural analysis is complex. With SimScale, capturing valuable insights from complex simulations is simpler and easier to share within teams and organizations, even with varying levels of simulation expertise. Below, the workflow for a nonlinear static analysis is represented. As SimScale facilitates a cloud-driven design study, users can leverage parallel computation and solve both a higher number of design iterations and more iterations of increased complexity.<\/p>\n\n\n\n
<\/a>Nonlinear Static Analysis in the Cloud<\/h2>\n\n\n\n
To understand the snapping kinematics, a quick animation can be created when post-processing the results. With the help of the animation, the movement of the casing can be better understood and the regions where the stress value has built up above the yield stress can be identified. This offers an opportunity to further optimize the design by changing the shape or using another material to minimize stress.\u00a0<\/p>\n\n\n\n
<\/a>After acquiring the results of the first simulation, the next step was to run a few more iterations. Based on the first design results, changes and alterations could be made within the geometry to converge upon a better design candidate. The first design change enacted in this study was deleting one of the faces, and creating a filet instead of a sharp edge. As the CAD changes are done in Onshape<\/a>, a cloud-based tool, there is no need to download the file from Onshape and then upload it to SimScale\u2014all can be transferred with cloud integration between two platforms. The previous simulation template can be applied to the new geometry exactly as done in the previous step, requiring no reassessment of the physical constraints or the topological entities. They are already automatically reassociated with the new CAD model.\u00a0<\/p>\n\n\n\n A further variable to experiment with in order to optimize design is testing different materials. This is easily done by selecting a new material from the materials library in the simulation setup and assigning this material to the lid. In a similar manner, many different design strategies can be tried and further improved. Once the first simulation setup is completed, iterating on top of that is straightforward and fast, with the power of the parallel computation.\u00a0<\/p>\n\n\n\n After performing the first simulation on the design provided by the CAD engineer, the regions above the yield stress were clearly identified. Another interesting point detected was the fact that the support structure underneath the snap is not carrying any stress. As it does not provide added benefits to the structure, designers further assessed its significance in terms of manufacturing. In the second design, the snap is located without support underneath. The same result as with the first design is derived, proving that some cost could be saved in terms of manufacturing by removing the non-beneficial support element. And, in the last design, the shape of the snap is changed slightly, and also the sharp edge is rounded at the bottom part to have a smoother snapping operation.<\/p>\n\n\n\nElectronics Enclosure Design Insights<\/h2>\n\n\n\n