{"id":47119,"date":"2021-11-17T10:50:33","date_gmt":"2021-11-17T10:50:33","guid":{"rendered":"https:\/\/www.simscale.com\/?page_id=47119"},"modified":"2025-12-30T11:53:59","modified_gmt":"2025-12-30T11:53:59","slug":"rf-electronics-package-cooling","status":"publish","type":"page","link":"https:\/\/www.simscale.com\/docs\/validation-cases\/rf-electronics-package-cooling\/","title":{"rendered":"Validation Case: RF Electronics Package Cooling"},"content":{"rendered":"\n\n\n\n<p class=\"wp-block-paragraph\">This study aims at validating the CHT and CHT (IBM) solvers. A peer-reviewed publication of R.Boukhanouf\\(^1\\) focusing on thermal analyses and cooling of a Radio Frequency (RF) electronics package has been used as the basis for this validation case. Reasonable assumptions and approximations have been made to bridge uncertainty in the publication.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The validation study involves qualitative and quantitative comparisons between SimScale and the commercial CFD code FloTHERM involving:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>temperature, and<\/li>\n\n\n\n<li>velocity vectors<\/li>\n<\/ul>\n\n\n\n<div class=\"hw-block hw-btnWrapper hw-btnWrapper--alignCenter \">\n    <a href=\"https:\/\/www.simscale.com\/workbench\/?pid=953276614345064002&#038;mi=spec%3Ac4329229-2c29-4e05-ba8f-a106143db9cd%2Cservice%3ASIMULATION%2Cstrategy%3A101\" class=\"hw-btn    \" rel=\"noopener \" target=\"_blank\"    >\n        View Project    <\/a>\n<\/div>\n\n\n\n\n<h2 class=\"wp-block-heading\" id=\"geometry\">Geometry<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The battery pack was modeled using the CAD tool Onshape. Necessary assumptions were made to overcome missing\/inconsistent geometric data:<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2021\/11\/Reverse-Engineered-CAD-2.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"355\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2021\/11\/Reverse-Engineered-CAD-2-1024x355.jpg\" alt=\"the model from the publication was reversed engineered to be used in this validation case\" class=\"wp-image-48180\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2021\/11\/Reverse-Engineered-CAD-2-1024x355.jpg 1024w, https:\/\/frontend-assets.simscale.com\/media\/2021\/11\/Reverse-Engineered-CAD-2-300x104.jpg 300w, https:\/\/frontend-assets.simscale.com\/media\/2021\/11\/Reverse-Engineered-CAD-2-768x266.jpg 768w, https:\/\/frontend-assets.simscale.com\/media\/2021\/11\/Reverse-Engineered-CAD-2.jpg 1470w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/a><figcaption class=\"wp-element-caption\">Figure 1: A 1:1 model (right image) reverse-engineered from measurements and images provided in the publication (left image).<\/figcaption><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">The model contains the following parts:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>DC Shelf\n<ul class=\"wp-block-list\">\n<li>Upper Copper mount for DC component<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>DC Shelf components\n<ul class=\"wp-block-list\">\n<li>DC component with 15 \\(W\\) Heat Rating<\/li>\n\n\n\n<li><a href=\"https:\/\/resources.pcb.cadence.com\/blog\/2019-thermal-vias-for-circuit-board-heat-management-techniques-and-tips\" target=\"_blank\" rel=\"noreferrer noopener\">Thermal via circuit<\/a> built into RF4 PCB<\/li>\n\n\n\n<li>Solder layer<\/li>\n\n\n\n<li>Thermal insulating material (TIM)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>RF Shelf\n<ul class=\"wp-block-list\">\n<li>Upper Copper mount for RF components<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>RF components\n<ul class=\"wp-block-list\">\n<li>Three RF components with 60 \\(W\\) , 0.5 \\(W\\), 0.5 \\(W\\) Heat Ratings<\/li>\n\n\n\n<li>Aluminium RF4 PCB<\/li>\n\n\n\n<li>Dielectric substrate to insulate components from each other<\/li>\n\n\n\n<li>Solder layer<\/li>\n\n\n\n<li>Thermal insulating material (TIM)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>Heat sink:&nbsp;Finned Heat Exchanger&nbsp;&nbsp;<\/li>\n\n\n\n<li>Aluminium Enclosure Box<\/li>\n\n\n\n<li>Fan: Air delivery 11 \\(m^3 \\over \\ h\\) at 40 \\(^o C\\)<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"analysis-type-and-mesh\">Analysis Type and Mesh<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Tool Type<\/strong>: <a href=\"https:\/\/www.openfoam.com\/\" target=\"_blank\" rel=\"noreferrer noopener\">OpenFOAM\u24c7<\/a><\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Analysis Type<\/strong>: Incompressible, steady-state analysis with the <a href=\"https:\/\/www.simscale.com\/docs\/analysis-types\/conjugate-heat-transfer-analysis\/\">Conjugate Heat Transfer<\/a> (CHT) and <a href=\"https:\/\/www.simscale.com\/docs\/analysis-types\/immersed-boundary-analysis\/\">Conjugate Heat Transfer (IBM)<\/a> solvers.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Mesh and Element Types<\/strong>:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The&nbsp;<a href=\"https:\/\/www.simscale.com\/docs\/simulation-setup\/meshing\/standard\/\">Standard mesher<\/a>&nbsp;algorithm with tetrahedral and hexahedral cells was used to generate the mesh for the CHT runs. Meanwhile, CHT (IBM) uses cartesian meshes:<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large is-resized\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/CHTv2-and-CHT-IBM-meshes.png\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"545\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/CHTv2-and-CHT-IBM-meshes-1024x545.png\" alt=\"ibm and chtv2 meshes validation case heat sink\" class=\"wp-image-80259\" style=\"width:768px;height:636px\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/CHTv2-and-CHT-IBM-meshes-1024x545.png 1024w, https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/CHTv2-and-CHT-IBM-meshes-300x160.png 300w, https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/CHTv2-and-CHT-IBM-meshes-768x409.png 768w, https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/CHTv2-and-CHT-IBM-meshes.png 1088w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/a><figcaption class=\"wp-element-caption\">Figure 2: Three-dimensional CHT unstructured mesh containing tetrahedral and hexahedral elements created with the Standard algorithm (left) and cartesian mesh created for a CHT (IBM) simulation (right)<\/figcaption><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">A mesh sensitivity analysis has been carried out to determine the dependence of the CHT solver temperature predictions on the mesh:<\/p>\n\n\n\n<figure class=\"wp-block-table aligncenter\"><table><thead><tr><th class=\"has-text-align-center\" data-align=\"center\"><\/th><th class=\"has-text-align-center\" data-align=\"center\">Mesh Count<\/th><th class=\"has-text-align-center\" data-align=\"center\">Mesh Type<\/th><th class=\"has-text-align-center\" data-align=\"center\">TC@DC Component \\([\u00b0C]\\)<\/th><th class=\"has-text-align-center\" data-align=\"center\">TC@RF1 Component<br>\\([\u00b0C]\\)<\/th><th class=\"has-text-align-center\" data-align=\"center\">TC@RF2 Component<br> \\([\u00b0C]\\) <\/th><th class=\"has-text-align-center\" data-align=\"center\">TC@RF3 Component<br> \\([\u00b0C]\\) <\/th><\/tr><\/thead><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\">Mesh 1<\/td><td class=\"has-text-align-center\" data-align=\"center\">3.1M cells, 1.2M nodes<\/td><td class=\"has-text-align-center\" data-align=\"center\">Standard<\/td><td class=\"has-text-align-center\" data-align=\"center\">103.84<\/td><td class=\"has-text-align-center\" data-align=\"center\">130.26<\/td><td class=\"has-text-align-center\" data-align=\"center\">89.80<\/td><td class=\"has-text-align-center\" data-align=\"center\">89.80<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Mesh 2<\/td><td class=\"has-text-align-center\" data-align=\"center\">3.6M cells, 1.3M nodes<\/td><td class=\"has-text-align-center\" data-align=\"center\">Standard<\/td><td class=\"has-text-align-center\" data-align=\"center\">92.23<\/td><td class=\"has-text-align-center\" data-align=\"center\">121.33<\/td><td class=\"has-text-align-center\" data-align=\"center\">78.83<\/td><td class=\"has-text-align-center\" data-align=\"center\">78.83<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Absolute TC deviation (Mesh2-Mesh1)<\/td><td class=\"has-text-align-center\" data-align=\"center\"><\/td><td class=\"has-text-align-center\" data-align=\"center\"><\/td><td class=\"has-text-align-center\" data-align=\"center\">11.61<\/td><td class=\"has-text-align-center\" data-align=\"center\">8.93<\/td><td class=\"has-text-align-center\" data-align=\"center\">10.97<\/td><td class=\"has-text-align-center\" data-align=\"center\">10.97<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">% TC deviation (Mesh2-Mesh1)<\/td><td class=\"has-text-align-center\" data-align=\"center\"><\/td><td class=\"has-text-align-center\" data-align=\"center\"><\/td><td class=\"has-text-align-center\" data-align=\"center\">12.59%<\/td><td class=\"has-text-align-center\" data-align=\"center\">7.36%<\/td><td class=\"has-text-align-center\" data-align=\"center\">10.97%<\/td><td class=\"has-text-align-center\" data-align=\"center\">10.97%<\/td><\/tr><\/tbody><\/table><figcaption class=\"wp-element-caption\">Table 1: The results of the mesh sensitivity analysis after the area-averaged temperatures of the package components have been compared.<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>TC<\/strong> stands for the Temperature in Celsius degrees. The values in the table are area-averaged values over the respective components.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"simulation-setup\">Simulation Setup<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Fluid Material<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Air\n<ul class=\"wp-block-list\">\n<li>Dynamic viscosity \\((\\mu)\\) = 1.83e-5 \\(m^2 \\over\\ s\\) <\/li>\n\n\n\n<li>Specific heat = 1004 \\(J \\over\\ (kg \\times\\ K)\\)<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Solid Materials<\/strong>:<br>The table highlights the materials and thermal conductivity values used for each component of&nbsp;the RF electronics package:<\/p>\n\n\n\n<figure class=\"wp-block-table aligncenter\"><table><thead><tr><th class=\"has-text-align-center\" data-align=\"center\">Component<\/th><th class=\"has-text-align-center\" data-align=\"center\">Material<\/th><th class=\"has-text-align-center\" data-align=\"center\">Thermal conductivity \\(W \\over \\ (m \\times \\ K) \\)<\/th><\/tr><\/thead><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\">Enclosure Box<\/td><td class=\"has-text-align-center\" data-align=\"center\">Aluminum<\/td><td class=\"has-text-align-center\" data-align=\"center\">180<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">RF &amp; DC shelves<\/td><td class=\"has-text-align-center\" data-align=\"center\">Copper<\/td><td class=\"has-text-align-center\" data-align=\"center\">385<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Solder layer<\/td><td class=\"has-text-align-center\" data-align=\"center\">Tin<\/td><td class=\"has-text-align-center\" data-align=\"center\">50<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Thermal via circuit<\/td><td class=\"has-text-align-center\" data-align=\"center\">(Derived)<\/td><td class=\"has-text-align-center\" data-align=\"center\">22 (Derived)<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">TIM<\/td><td class=\"has-text-align-center\" data-align=\"center\">Sil Pad\u00ae and Gap Pad\u00ae<\/td><td class=\"has-text-align-center\" data-align=\"center\">2<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Dielectric Substrate<\/td><td class=\"has-text-align-center\" data-align=\"center\">Dielectric material<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.6<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">PCB<\/td><td class=\"has-text-align-center\" data-align=\"center\"> Aluminum <\/td><td class=\"has-text-align-center\" data-align=\"center\">180<\/td><\/tr><\/tbody><\/table><figcaption class=\"wp-element-caption\">Table 2: Properties of the solid materials<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">The RF components have been modeled as using the <a href=\"https:\/\/www.simscale.com\/docs\/simulation-setup\/advanced-concepts\/thermal-resistance-networks\/\">thermal resistance network<\/a> and therefore are not assigned any material properties.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The Heat Ratings and Thermal Resistance values used are respectively as follows:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>RF1: 15 \\(W\\), 0.7 \\(^o C \\over \\ W\\)&nbsp;<\/li>\n\n\n\n<li>RF2: 0.5 \\(W\\), 0.8 \\(^o C \\over \\ W\\) &nbsp;<\/li>\n\n\n\n<li>RF3: 0.5 \\(W\\), 0.8 \\(^o C \\over \\ W\\)&nbsp;<\/li>\n\n\n\n<li>DC: 60 \\(W\\), 0.78 \\(^o C \\over \\ W\\)<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Boundary Conditions<\/strong>: <\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><a href=\"https:\/\/www.simscale.com\/docs\/simulation-setup\/boundary-conditions\/natural-convection-inlet-outlet\/#:~:text=The%20Natural%20Convection%20Inlet%2FOutlet,windows%20when%20modeling%20a%20room.\">Natural convection inlet-outlet<\/a> with an ambient temperature of 40 \\(^o C\\)<\/li>\n\n\n\n<li>Fan as a <a href=\"https:\/\/www.simscale.com\/docs\/simulation-setup\/advanced-concepts\/momentum-sources\/\">momentum source<\/a> with a velocity of 1.85 \\(m \\over \\ s\\)<\/li>\n\n\n\n<li>Thermal Resistance Network: Star Network Resistance Model<\/li>\n\n\n\n<li>DC Component:\n<ul class=\"wp-block-list\">\n<li>Resistance: 0.78 \\(K \\over \\ W\\)<\/li>\n\n\n\n<li>Power Source: 15 \\(W\\)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>RF1 Component:\n<ul class=\"wp-block-list\">\n<li>Resistance: 0.7 \\(K \\over \\ W\\)<\/li>\n\n\n\n<li>Power Source: 60 \\(W\\)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>RF2 Component:\n<ul class=\"wp-block-list\">\n<li>Resistance: 0.8 \\(K \\over \\ W\\)<\/li>\n\n\n\n<li>Power Source: 0.5 \\(W\\)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li>RF2 Component:\n<ul class=\"wp-block-list\">\n<li>Resistance: 0.8 \\(K \\over \\ W\\)<\/li>\n\n\n\n<li>Power Source: 0.5 \\(W\\)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><a href=\"https:\/\/www.simscale.com\/docs\/simulation-setup\/boundary-conditions\/wall\/\">No-slip walls<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/www.simscale.com\/docs\/simulation-setup\/contacts\/\">Coupled contact interfaces<\/a><\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"result-comparison\">Result Comparison<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Convergence below 1e-3 has been achieved. Calculated physical quantities such as inlet pressure, outlet velocity, and cell average temperatures have also been allowed to converge to stable values.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The validation of the SimScale&#8217;s CHT has been carried out by qualitatively comparing temperatures and velocities with the reference results\\(^1\\). The reference results have been produced with the commercial CFD code Flotherm. All post-processing was done in SimScale&#8217;s online post-processor:<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"477\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist-1024x477.jpg\" alt=\"Comparison of cross-section 1 between FloTHERM; CHT IBM and CHT\" class=\"wp-image-109168\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist-1024x477.jpg 1024w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist-300x140.jpg 300w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist-768x358.jpg 768w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist-515x240.jpg 515w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist.jpg 1204w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/a><figcaption class=\"wp-element-caption\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/RF_TempDist.jpg\"><\/a>Figure 4: Qualitative comparison of the temperature distribution between FloTHERM (left), CHT IBM (center), and CHT (right)<\/figcaption><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">Another section was compared between the two:<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/NewCHT_Cross.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"467\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/NewCHT_Cross-1024x467.jpg\" alt=\"Comparison of cross-section 2  between FloTHERM; CHT IBM and CHT\" class=\"wp-image-109170\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/NewCHT_Cross-1024x467.jpg 1024w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/NewCHT_Cross-300x137.jpg 300w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/NewCHT_Cross-768x350.jpg 768w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/NewCHT_Cross-515x235.jpg 515w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/NewCHT_Cross.jpg 1333w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/a><figcaption class=\"wp-element-caption\">Figure 5: This comparison shows temperature distribution at the package mid-section between the FloTHERM (left), CHT IBM (center) and CHT (right) solvers.<\/figcaption><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">A quantitative comparison of the velocity field shows a good match between the two solvers:<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large is-resized\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/qualitative-comparison-2-1.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"407\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/qualitative-comparison-2-1-1024x407.jpg\" alt=\"velocity vectors comparison flowtherm simscale\" class=\"wp-image-80262\" style=\"object-fit:cover;width:765px;height:306px\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/qualitative-comparison-2-1-1024x407.jpg 1024w, https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/qualitative-comparison-2-1-300x119.jpg 300w, https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/qualitative-comparison-2-1-768x305.jpg 768w, https:\/\/frontend-assets.simscale.com\/media\/2023\/09\/qualitative-comparison-2-1.jpg 1202w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/a><figcaption class=\"wp-element-caption\">Figure 6: FloTHERM (left), CHT IBM (center), and CHT (right) showcase consistency when it comes to the velocity vectors, to both direction and magnitude.<\/figcaption><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">Except from the qualitative comparison, a quantitative study was performed:<\/p>\n\n\n\n<figure class=\"wp-block-table aligncenter\"><table><thead><tr><th class=\"has-text-align-center\" data-align=\"center\">Component<\/th><th class=\"has-text-align-center\" data-align=\"center\">FloTHERM  <br>\\([\u00b0C]\\) <\/th><th class=\"has-text-align-center\" data-align=\"center\">CHT (IBM) \\([\u00b0C]\\)<\/th><th class=\"has-text-align-center\" data-align=\"center\">CHT <br>\\([\u00b0C]\\)<\/th><th class=\"has-text-align-center\" data-align=\"center\">TC deviation (CHT IBM &#8211; FloTHERM) \\([\u00b0C]\\)<\/th><th class=\"has-text-align-center\" data-align=\"center\">TC deviation (CHT &#8211; FloTHERM) \\([\u00b0C]\\)<\/th><\/tr><\/thead><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\">TC@DC Component<\/td><td class=\"has-text-align-center\" data-align=\"center\">101<\/td><td class=\"has-text-align-center\" data-align=\"center\">98.46<\/td><td class=\"has-text-align-center\" data-align=\"center\">92.23<\/td><td class=\"has-text-align-center\" data-align=\"center\">-2.54<\/td><td class=\"has-text-align-center\" data-align=\"center\">-8.77<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\"> TC@RF1 Component <\/td><td class=\"has-text-align-center\" data-align=\"center\">137.85<\/td><td class=\"has-text-align-center\" data-align=\"center\">133.77<\/td><td class=\"has-text-align-center\" data-align=\"center\">121.33<\/td><td class=\"has-text-align-center\" data-align=\"center\">-4.08<\/td><td class=\"has-text-align-center\" data-align=\"center\">-16.52<\/td><\/tr><\/tbody><\/table><figcaption class=\"wp-element-caption\">Table 3: A qualitative comparison of area-averaged temperatures on the package components has been performed.<\/figcaption><\/figure>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/DC-and-RF1-Component-Temperature-Comparison.png\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"371\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/DC-and-RF1-Component-Temperature-Comparison.png\" alt=\"Column Chart showing temepraturs for the three models (FloTHERM, CHT IBM and CHT)\n\" class=\"wp-image-109169\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/DC-and-RF1-Component-Temperature-Comparison.png 600w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/DC-and-RF1-Component-Temperature-Comparison-300x186.png 300w, https:\/\/frontend-assets.simscale.com\/media\/2025\/12\/DC-and-RF1-Component-Temperature-Comparison-515x318.png 515w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/a><figcaption class=\"wp-element-caption\">Figure 7: Quantitative temperature comparison on the electronic components<\/figcaption><\/figure>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\">From Table 3 and Figure 7 above, the DC and RF1 component temperatures are within 5% and 8% of the reference FloTHERM results respectively.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">This deviation could be traced down to two possible factors:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The publication does not clarify how the thermal resistance has been implemented (top\/board\/side).&nbsp;<\/li>\n\n\n\n<li>Temperature measurement type in the paper.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Overall, The study shows a moderately good agreement between the temperature predictions from the two CFD solvers.<\/p>\n\n\n\n\n<div class='hw-block hw-references hw-references'>\n    <p class='hw-references__title'>References<\/p>\n    <ul class='hw-references__list'>\n\n        <li><cite><a href=\"https:\/\/www.sciencedirect.com\/science\/article\/abs\/pii\/S1359431110002590?via%3Dihub\" target=\"_blank\" rel=\"nofollow noopener\">A CFD analysis of an electronics cooling enclosure for application in telecommunication systems<\/a><\/cite><\/li><li><cite><a href=\"https:\/\/resources.pcb.cadence.com\/blog\/2019-thermal-vias-for-circuit-board-heat-management-techniques-and-tips\" target=\"_blank\" rel=\"nofollow noopener\"> Thermal Vias for Circuit Board Heat Management: Techniques and Tips<\/a><\/cite><\/li>\n    <\/ul>\n<\/div>\n\n\n\n<div class=\"hw-block hw-note hw-note--info hw-note\">\n    <div class=\"hw-note__title\">\n        <p class=\"hw-note__titleText\"><i class=\"fa fa-exclamation-circle\" aria-hidden=\"true\"><\/i>Note<\/p>\n    <\/div>\n    <div class=\"hw-note__body\">\n        <p>If you still encounter problems validating you simulation, then please post the issue on our <a href=\"https:\/\/www.simscale.com\/forum\/\">forum<\/a> or <a href=\"mailto:support@simscale.com\">contact us<\/a>.<\/p>\n    <\/div>\n<\/div>\nenclosure for application in telecommunication systems\\u003c\/a\\u003e&#8221;,&#8221;_references_0_reference&#8221;:&#8221;field_5e4d0f1a1cce0&#8243;,&#8221;references_1_reference&#8221;:&#8221;\\u003ca href=\\u0022https:\/\/resources.pcb.cadence.com\/blog\/2019-thermal-vias-for-circuit-board-heat-management-techniques-and-tips\\u0022 target=\\u0022_blank\\u0022 rel=\\u0022nofollow noopener\\u0022\\u003e Thermal Vias for Circuit Board Heat Management: Techniques and Tips\\u003c\/a\\u003e&#8221;,&#8221;_references_1_reference&#8221;:&#8221;field_5e4d0f1a1cce0&#8243;,&#8221;references&#8221;:2,&#8221;_references&#8221;:&#8221;field_5e4d0ef21ccdf&#8221;},&#8221;mode&#8221;:&#8221;preview&#8221;} \/&#8211;>\n\n\n<div class=\"hw-block hw-note hw-note--info hw-note\">\n    <div class=\"hw-note__title\">\n        <p class=\"hw-note__titleText\"><i class=\"fa fa-exclamation-circle\" aria-hidden=\"true\"><\/i>Note<\/p>\n    <\/div>\n    <div class=\"hw-note__body\">\n        <p>If you still encounter problems validating you simulation, then please post the issue on our <a href=\"https:\/\/www.simscale.com\/forum\/\">forum<\/a> or <a href=\"mailto:support@simscale.com\">contact us<\/a>.<\/p>\n    <\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>This study aims at validating the CHT and CHT (IBM) solvers. A peer-reviewed publication of R.Boukhanouf\\(^1\\) focusing...","protected":false},"author":113,"featured_media":109168,"parent":17191,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"templates\/template-documentation.php","meta":{"_acf_changed":false,"_crdt_document":"","inline_featured_image":false,"footnotes":""},"class_list":["post-47119","page","type-page","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages\/47119","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/users\/113"}],"replies":[{"embeddable":true,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/comments?post=47119"}],"version-history":[{"count":0,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages\/47119\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages\/17191"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/media\/109168"}],"wp:attachment":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/media?parent=47119"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}