{"id":42143,"date":"2021-02-18T11:52:21","date_gmt":"2021-02-18T11:52:21","guid":{"rendered":"https:\/\/www.simscale.com\/?page_id=42143"},"modified":"2026-01-30T15:41:19","modified_gmt":"2026-01-30T15:41:19","slug":"led-thermal-management-chip-on-plate","status":"publish","type":"page","link":"https:\/\/www.simscale.com\/docs\/validation-cases\/led-thermal-management-chip-on-plate\/","title":{"rendered":"Validation Case: LED Thermal Management – Chip on Plate (COP)"},"content":{"rendered":"\n

This case validates the thermal management inside an LED against the CFD and experimental results obtained in the conference paper, “Thermal Analyses and Measurements of Low-Cost COP Package for High-Power LED”\\(^1\\), using the Conjugate Heat Transfer analysis type in SimScale.<\/p>\n\n\n\n\n\n\n\n

\n \n View Project <\/a>\n<\/div>\n\n\n\n\n

Geometry<\/h2>\n\n\n\n

The geometry consists of a cylindrical LED module constructed using the images from the conference paper\\(^1\\) with certain thickness assumptions for the Silicone encapsulant and the Aluminum Pkg substrate.<\/p>\n\n\n\n

\"led<\/a>
Figure 1: Detailed LED module CAD geometry with associated parts used for the validation case<\/figcaption><\/figure>\n\n\n\n

A cubic domain, with seven times the size of the LED module, is also constructed to model the air region surrounding the module in each direction.<\/p>\n\n\n\n

Analysis Type and Mesh<\/h2>\n\n\n\n

Tool Type<\/strong>: OpenFOAM\u00ae<\/a><\/p>\n\n\n\n

Analysis Type<\/strong>: Incompressible, steady state Conjugate Heat Transfer<\/a><\/p>\n\n\n\n

Turbulence Model<\/strong>: Laminar flow<\/p>\n\n\n\n

Mesh and Element Types<\/strong>: The mesh is generated using the standard<\/a><\/em> meshing algorithm in SimScale. <\/p>\n\n\n\n

Mesh<\/strong><\/td>Number of cells<\/strong><\/td>Element type<\/strong><\/td><\/tr>
F0.5 (Coarse)<\/td>144000<\/td>Tetrahedral and hexahedral<\/td><\/tr>
F5.5 (Moderate)<\/td>725000<\/td>Tetrahedral and hexahedral<\/td><\/tr>
F8.5 (Fine)<\/td>4200000<\/td>Tetrahedral and hexahedral<\/td><\/tr><\/tbody><\/table>
Table 1: Standard mesh characteristics for three different fineness levels: 0.5, 5.5, and 8.5<\/figcaption><\/figure>\n\n\n
\n
\"\"<\/a>
Figure 2: LED module meshed with a fineness of 5.5 with tet and hex elements using the standard algorithm<\/figcaption><\/figure>\n<\/div>\n\n\n

Simulation Setup<\/h2>\n\n\n\n

Material<\/strong><\/h3>\n\n\n\n

Solid:<\/strong> The materials constituting the LED are tabulated with their properties as follows:<\/p>\n\n\n\n

Materials<\/strong><\/td>Thermal conductivity \\([W\/m\\ \u00b0C]\\)<\/strong><\/td>Mass density \\([kg\/m^3]\\)<\/strong><\/td>Specific heat \\([J\/kg\\ \u00b0C]\\)<\/strong><\/td><\/tr>
Silicone (Encapsulant)<\/td>0.3<\/td>1200<\/td>2000<\/td><\/tr>
LED Chip<\/td>42<\/td>2330<\/td>712<\/td><\/tr>
Sapphire (Chip substrate)<\/td>35<\/td>3980<\/td>761<\/td><\/tr>
Ag epoxy (die attach)<\/td>8<\/td>2300<\/td>671<\/td><\/tr>
Aluminum (Pkg substrate)<\/td>220<\/td>2702<\/td>910<\/td><\/tr>
Thermal Grease<\/td>3.6<\/td>1180<\/td>1044<\/td><\/tr>
Copper (Heat sink)<\/td>380<\/td>8800<\/td>380<\/td><\/tr><\/tbody><\/table>
Table 2: Material properties for the solid parts in the LED module<\/figcaption><\/figure>\n\n\n\n

Fluid<\/strong>: Air<\/p>\n\n\n\n