{"id":18189,"date":"2018-12-16T18:38:00","date_gmt":"2018-12-16T18:38:00","guid":{"rendered":"https:\/\/www.simscale.com\/?page_id=18189"},"modified":"2021-05-20T11:47:24","modified_gmt":"2021-05-20T11:47:24","slug":"heat-transfer-electronic-design","status":"publish","type":"page","link":"https:\/\/www.simscale.com\/docs\/validation-cases\/heat-transfer-electronic-design\/","title":{"rendered":"Validation Case: Heat Transfer in an Electronics Design"},"content":{"rendered":"\n\n\n\n<p class=\"wp-block-paragraph\">This case belongs to solid mechanics. The aim of this test case is to validate the following parameters within the components of an electronics design:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Transient change in temperature with respect to ambient temperature.<\/li><\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">The simulation results of SimScale are compared to the results presented in [Bruce]\\(^1\\).<\/p>\n\n\n\n<div class=\"hw-block hw-btnWrapper hw-btnWrapper--alignCenter \">\n    <a href=\"https:\/\/www.simscale.com\/workbench\/?pid=7177631627735486047&#038;mi=spec%3Aa6543c29-0da9-4161-9697-15b9af693c9b%2Cservice%3ASIMULATION%2Cstrategy%3A215\" class=\"hw-btn    \" rel=\"noopener \" target=\"_blank\"    >\n        View Project    <\/a>\n<\/div>\n\n\n\n\n<h2 class=\"wp-block-heading\" id=\"geometry\" >Geometry<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The geometry used for the case is as follows:<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large is-resized\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/Geometry-1.png\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/Geometry-1-1024x700.png\" alt=\"simulation ready geometry cad model workbench\" class=\"wp-image-33474\" width=\"768\" height=\"525\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/Geometry-1-1024x700.png 1024w, https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/Geometry-1-300x205.png 300w, https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/Geometry-1-768x525.png 768w, https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/Geometry-1.png 1146w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/a><figcaption>Figure 1: Simulation ready CAD model<\/figcaption><\/figure><\/div>\n\n\n\n<p class=\"wp-block-paragraph\">A more descriptive schematic of the components explains the configuration as shown in Figure 2:<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/IC.png\"><img loading=\"lazy\" decoding=\"async\" width=\"533\" height=\"288\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/IC.png\" alt=\"ic electronics package lid die pcb tim heat sink base configuration\" class=\"wp-image-33475\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/IC.png 533w, https:\/\/frontend-assets.simscale.com\/media\/2020\/09\/IC-300x162.png 300w\" sizes=\"auto, (max-width: 533px) 100vw, 533px\" \/><\/a><figcaption>Figure 2: High-power IC package geometry<\/figcaption><\/figure><\/div>\n\n\n\n<p class=\"wp-block-paragraph\">The analysis is carried out on a high-power IC package that is attached between the heatsink base and the PCB substrate. The components explicitly represented in the simulation model are the die, TIM 1, lid, TIM 2, and the heat sink base (where TIM = Thermal Interface Material). These components are shown inside the dashed square box above.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The following table displays the dimensions of each component in the electronics design:<\/p>\n\n\n\n<figure class=\"wp-block-table aligncenter\"><table><thead><tr><th class=\"has-text-align-center\" data-align=\"center\">Component<\/th><th class=\"has-text-align-center\" data-align=\"center\">Length \\([mm]\\)<\/th><th class=\"has-text-align-center\" data-align=\"center\">Width <strong>\\([mm]\\)<\/strong><\/th><th class=\"has-text-align-center\" data-align=\"center\">Thickness <strong>\\([mm]\\)<\/strong><\/th><\/tr><\/thead><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\">Die<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.50<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">TIM 1<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.10<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Lid<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.50<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">TIM 2<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">0.05<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Heat sink base<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">13<\/td><td class=\"has-text-align-center\" data-align=\"center\">6.00<\/td><\/tr><\/tbody><\/table><figcaption>Table 1: The dimensions of the model&#8217;s components<\/figcaption><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"analysis-type-and-mesh\" >Analysis Type and Mesh<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Tool type<\/strong>: Code_Aster<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Analysis type<\/strong>: <a href=\"https:\/\/www.simscale.com\/docs\/analysis-types\/heat-transfer\/\">Heat transfer<\/a>, Non-linear<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Time dependency<\/strong>: Transient<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Mesh and element types<\/strong>: SimScale&#8217;s <a href=\"https:\/\/www.simscale.com\/docs\/simulation-setup\/meshing\/standard\/\"><em>Standard<\/em><\/a> algorithm was used to generate the mesh for the electronics design.<\/p>\n\n\n\n<figure class=\"wp-block-table aligncenter\"><table><thead><tr><th class=\"has-text-align-center\" data-align=\"center\">Meshing algorithm<\/th><th class=\"has-text-align-center\" data-align=\"center\">No. of nodes<\/th><th class=\"has-text-align-center\" data-align=\"center\">No. of volumes<\/th><th>Mesh Elements<\/th><\/tr><\/thead><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\">Standard<\/td><td class=\"has-text-align-center\" data-align=\"center\">38694<\/td><td class=\"has-text-align-center\" data-align=\"center\">184359<\/td><td>Tetrahedral\/Hexahedral<\/td><\/tr><\/tbody><\/table><figcaption>Table 2: Details of the IC package mesh<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">The final mesh can be seen below:<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/Mesh-2.png\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"716\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/Mesh-2-1024x716.png\" alt=\"standard meshing algorithm electronics design \" class=\"wp-image-32668\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/Mesh-2-1024x716.png 1024w, https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/Mesh-2-300x210.png 300w, https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/Mesh-2-768x537.png 768w, https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/Mesh-2.png 1280w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/a><figcaption>Figure 3: The final mesh consisting of tetrahedral and hexahedral elements. <\/figcaption><\/figure><\/div>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"simulation-setup\" >Simulation Setup<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Material:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Isotropic with the following specifications for each part:<\/li><\/ul>\n\n\n\n<figure class=\"wp-block-table aligncenter\"><table><thead><tr><th class=\"has-text-align-center\" data-align=\"center\">Component<\/th><th class=\"has-text-align-center\" data-align=\"center\">Material<\/th><th class=\"has-text-align-center\" data-align=\"center\">Thermal conductivity <strong>\\([ \\frac{W}{m\\ K}] \\)<\/strong> <\/th><th class=\"has-text-align-center\" data-align=\"center\">Density \\([\\frac{kg}{m^3}]\\) <\/th><th class=\"has-text-align-center\" data-align=\"center\">Specific heat&nbsp;<strong>\\([\\frac{J}{kg\\ K}] \\)<\/strong><\/th><\/tr><\/thead><tbody><tr><td class=\"has-text-align-center\" data-align=\"center\">        Die                                 <\/td><td class=\"has-text-align-center\" data-align=\"center\">Silicon<\/td><td class=\"has-text-align-center\" data-align=\"center\">111<\/td><td class=\"has-text-align-center\" data-align=\"center\">2330<\/td><td class=\"has-text-align-center\" data-align=\"center\">668<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">TIM1<\/td><td class=\"has-text-align-center\" data-align=\"center\">Ag-Epoxy<\/td><td class=\"has-text-align-center\" data-align=\"center\">2.0<\/td><td class=\"has-text-align-center\" data-align=\"center\">4400<\/td><td class=\"has-text-align-center\" data-align=\"center\">400<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Lid<\/td><td class=\"has-text-align-center\" data-align=\"center\">Copper<\/td><td class=\"has-text-align-center\" data-align=\"center\">390<\/td><td class=\"has-text-align-center\" data-align=\"center\">8890<\/td><td class=\"has-text-align-center\" data-align=\"center\">385<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">TIM2<\/td><td class=\"has-text-align-center\" data-align=\"center\">Grease Aluminium filler particle<\/td><td class=\"has-text-align-center\" data-align=\"center\">1.0<\/td><td class=\"has-text-align-center\" data-align=\"center\">2500<\/td><td class=\"has-text-align-center\" data-align=\"center\">900<\/td><\/tr><tr><td class=\"has-text-align-center\" data-align=\"center\">Heat sink base<\/td><td class=\"has-text-align-center\" data-align=\"center\">Copper<\/td><td class=\"has-text-align-center\" data-align=\"center\">390<\/td><td class=\"has-text-align-center\" data-align=\"center\">8890<\/td><td class=\"has-text-align-center\" data-align=\"center\">385<\/td><\/tr><\/tbody><\/table><figcaption>Table 3: Material properties for each component<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Initial conditions:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Temperature \\(T\\) =&nbsp;273.15 \\(K\\) &nbsp;<\/li><\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Boundary conditions:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li><strong>Heat flux loads:<\/strong><ul><li><em>Surface heat flux:<\/em><br>A power of 1 \\(W\\) is applied to the top surface of the die which is in contact with TIM 1. Therefore, the resulting surface heat flux at this surface is calculated by dividing the power with respect to the die surface area.<br>Surface heat flux = 1\/(169e-6) = 5917.1598 \\(W \\over \\ m^2\\)<\/li><li><em>Convective heat flux:<\/em><br>The cooling effect of the heatsink fins is collectively represented through a heat transfer coefficient that is directly applied to the heatsink base (top surface of the geometry). Therefore, a convective heat flux boundary condition is used to represent the thermal resistance offered by the heatsink to the surrounding air.<br>Convective heat flux = 20000 \\(W \\over \\ m^2  \\ K\\)<\/li><\/ul><\/li><\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"electronics-design-result-comparison\" >Electronics Design Result Comparison<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The temperature distribution of the IC package is as shown below:<\/p>\n\n\n\n<figure class=\"wp-block-image alignnone size-large\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/results.png\"><img decoding=\"async\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/results-1024x686.png\" alt=\"temperature distribution IC package\" class=\"wp-image-32669\"\/><\/a><figcaption>Figure 4: Temperature distribution as seen in the SimScale&#8217;s post processor.<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">The comparison of SimScale results with that of [Bruce]\\(^1\\) for the die, lid, and heat sink is shown below:<\/p>\n\n\n\n<figure class=\"wp-block-image alignnone size-large\"><a href=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/5-Temp-graph.png\"><img loading=\"lazy\" decoding=\"async\" width=\"877\" height=\"619\" src=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/5-Temp-graph.png\" alt=\"temperature distribution ambient results comparison ic package heat transfer\" class=\"wp-image-32701\" srcset=\"https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/5-Temp-graph.png 877w, https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/5-Temp-graph-300x212.png 300w, https:\/\/frontend-assets.simscale.com\/media\/2020\/08\/5-Temp-graph-768x542.png 768w\" sizes=\"auto, (max-width: 877px) 100vw, 877px\" \/><\/a><figcaption>Figure 5: Temperature change w.r.t ambient temperature versus time plot comparison with [Bruce]<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">The results are calculated by deducting the initial temperature condition of 273.15 \\(K\\) from the average temperature value of each area for 150 timesteps.<br>A slight deviation in the temperature graphs comparison above is due to the approximation error caused during the extraction of temperature values from the digital plots.<\/p>\n\n\n\n\n<div class='hw-block hw-references hw-references'>\n    <p class='hw-references__title'>References<\/p>\n    <ul class='hw-references__list'>\n\n        <li><cite><a href=\"https:\/\/www.electronics-cooling.com\/2011\/12\/transient-modelling-of-a-high-power-ic-package-part-1\/\" target=\"_blank\" rel=\"nofollow noopener\">[Bruce]  Bruce Guenin, \u201cCalculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1\u201d Calculation Corner, Computer, IT Products, Number 4, Software\/Modeling, Volume 17, December 22, 201<\/a><\/cite><\/li>\n    <\/ul>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>This case belongs to solid mechanics. The aim of this test case is to validate the following parameters within the components...","protected":false},"author":94,"featured_media":0,"parent":17191,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"templates\/template-documentation.php","meta":{"_acf_changed":false,"_crdt_document":"","inline_featured_image":false,"footnotes":""},"class_list":["post-18189","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages\/18189","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/users\/94"}],"replies":[{"embeddable":true,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/comments?post=18189"}],"version-history":[{"count":0,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages\/18189\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/pages\/17191"}],"wp:attachment":[{"href":"https:\/\/www.simscale.com\/wp-json\/wp\/v2\/media?parent=18189"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}