{"id":18150,"date":"2018-12-16T17:58:26","date_gmt":"2018-12-16T17:58:26","guid":{"rendered":"https:\/\/www.simscale.com\/?page_id=18150"},"modified":"2026-02-08T00:35:42","modified_gmt":"2026-02-08T00:35:42","slug":"conjugate-heat-transfer-rectangular-fins","status":"publish","type":"page","link":"https:\/\/www.simscale.com\/docs\/validation-cases\/conjugate-heat-transfer-rectangular-fins\/","title":{"rendered":"Validation Case: Conjugate Heat Transfer – Rectangular Fins"},"content":{"rendered":"\n

This validation case belongs to fluid dynamics. The aim of this validation case is to validate the Conjugate heat transfer<\/em> (CHT)<\/em><\/a> analysis implemented in SimScale.<\/p>\n\n\n\n\n\n\n\n

The simulation results of SimScale were compared to the results presented in the study titled “Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration”\\(^1\\) written by L. Ventola, G. Curcuruto, et. al. <\/p>\n\n\n\n

\n \n View Project <\/a>\n<\/div>\n\n\n\n\n

Geometry<\/h2>\n\n\n\n

The geometry used for the case has three regions, which are as follows: <\/p>\n\n\n\n

1. Enclosure – Fluid Region<\/strong><\/h3>\n\n\n\n

The length of the fluid region upstream of the heat sink is 6 times the length of the heat sink \\((L)\\) and the fluid region length downstream is 15 times \\(L\\) visualized in the figure below:<\/p>\n\n\n

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\"Validation<\/a>
Figure 1: Dimension of enclosure based on the length of the heat sink<\/figcaption><\/figure>\n<\/div>\n\n\n

2. Heat Sink<\/strong><\/h3>\n\n\n\n

The model of the heat sink with its dimensions can be seen in the figure and table below:<\/p>\n\n\n

\n
\"model<\/a>
Figure 2: Heat sink model<\/figcaption><\/figure>\n<\/div>\n\n\n
Dimension \\([mm]\\)<\/strong><\/td>Value<\/strong><\/td><\/tr>
h<\/strong> (height)<\/td>21.8<\/td><\/tr>
W<\/strong> (width)<\/td>41.4<\/td><\/tr>
L<\/strong> (length)<\/td>57.2<\/td><\/tr>
t_b<\/strong> (base height)<\/td>8.4<\/td><\/tr>
t<\/strong> (thickness of fin)<\/td>1<\/td><\/tr>
p<\/strong> (spacing between adjacent fins)<\/td>2.1<\/td><\/tr>
N<\/strong> (number of fins)<\/td>14<\/td><\/tr><\/tbody><\/table>
Table 1: Dimensions of the heat sink<\/figcaption><\/figure>\n\n\n\n

3. Heat Source<\/strong><\/h3>\n\n\n\n

The heat source is a chip with the dimensions shown in the table below and has a contact surface area \\((A_s)\\) with a heat sink of 1.555 \\(cm^2\\).<\/p>\n\n\n

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\"Validation<\/a>
Figure 3: Chip heat source used in validation case <\/figcaption><\/figure>\n<\/div>\n\n\n
Dimension<\/strong> \\([mm]\\)<\/strong><\/td>Value <\/strong><\/td><\/tr>
a<\/strong> <\/td>15.5<\/td><\/tr>
b<\/strong> <\/td>10<\/td><\/tr>
c<\/strong> <\/td>4.5<\/td><\/tr>
d<\/strong> <\/td>9<\/td><\/tr>
e<\/strong> <\/td>1.3<\/td><\/tr><\/tbody><\/table>
Table 2: Chip dimension in \\(mm\\)<\/figcaption><\/figure>\n\n\n\n
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<\/i>Chip Model<\/p>\n <\/div>\n

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STP130NS04ZB by STMicroelectronics<\/p>\n <\/div>\n<\/div>\n\n\n\n

Analysis Type and Mesh<\/h2>\n\n\n\n

Tool Type<\/strong>: OpenFOAM\u00ae<\/p>\n\n\n\n

Analysis Type<\/strong>: Conjugate Heat Transfer<\/a><\/p>\n\n\n\n

Mesh and Element Types<\/strong>:<\/p>\n\n\n\n

The mesh was generated using the Standard<\/a><\/em> meshing algorithm. The following table provides the details of the mesh:<\/p>\n\n\n\n

Mesh Type<\/strong><\/td>Number of Cell<\/strong>s<\/td>Element Type<\/strong><\/td><\/tr>
Standard<\/td>603883<\/td>3D Polyhedral<\/td><\/tr><\/tbody><\/table>
Table 3: Details of the generated mesh<\/figcaption><\/figure>\n\n\n
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\"CHT<\/a>
Figure 4: Standard mesh of enclosure with 3D polyhedral elements<\/figcaption><\/figure>\n<\/div>\n\n\n

A region refinement was added to the heat source, heat sink, and the area close to the heat sink to be able to accurately capture the features of the heat sink as well as the wake region. In order to reduce the cell count and therefore decrease the run time, a symmetry plane in the XZ-Plane is used. A local element refinement was further used to increase the fineness around the fins of the heat sink. The mesh of the heat sink, heat source, and symmetry plane can be seen in the figure below:<\/p>\n\n\n\n

\"Validation<\/a>
Figure 5: A close view of the mesh on the flow region, fins, and the chip. Volume and surface custom sizing were added to refine the mesh in the wake region and on the fins.<\/figcaption><\/figure>\n\n\n\n

Simulation Setup<\/h2>\n\n\n\n

Material<\/strong>:<\/p>\n\n\n\n